Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and input-output (I/O) chips in a single, advanced package. As AI chip packages scale to more complex architectures like 2.5D and 3D chiplet stacking, the demand for larger interposers and advanced substrates drives the transition from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters or more, enabling designers to build larger AI chips and achieve substantially higher output.
Applied is already a leading supplier of advanced packaging technologies and has been working to accelerate the transition to advanced panel substrates by developing a strong portfolio of manufacturing systems spanning digital lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD) and etch along with eBeam metrology and inspection. The addition of NEXX’s panel-level electrochemical deposition (ECD) technology will broaden Applied’s portfolio and served addressable market, allowing Applied to develop co-optimized solutions for fine-pitch I/O wiring and accelerate advanced packaging roadmaps for AI chipmakers and systems companies.
“Having NEXX join Applied Materials complements our leadership in advanced packaging, particularly in panel processing – an area where we see tremendous opportunities for customer co-innovation and growth in the years ahead,” said Dr.
“We are excited for NEXX to be a part of Applied Materials because together, we can accelerate the computing industry’s adoption of large-format advanced packaging technologies,” said
The transaction is expected to close within the next several months and is subject to customary closing conditions. No regulatory approvals are required.
Following the close of the transaction, the NEXX team will be incorporated into Applied’s
Forward-Looking Statements
This press release contains forward-looking statements, including those regarding Applied’s pending acquisition of ASMPT Limited’s NEXX business, anticipated growth and trends in our businesses and markets, technology transitions, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: the ability of the parties to consummate the pending acquisition in a timely manner or at all; Applied’s ability to successfully integrate NEXX’s operations, products, technology and employees; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-
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Source: Applied Materials, Inc.