Applied Materials Announces Order From Texas Instruments for Black Diamond Low k Film System for Advanced Interconnect Development
SANTA CLARA, Calif.--(BUSINESS WIRE)--June 2, 1999--
Black Diamond(TM) Dielectric Film Provides Manufacturable CVD
Solution for Advanced Chip Circuit Structures
Texas Instruments, Inc. (TI) has ordered Applied Materials' Black Diamond low k dielectric film system for evaluation in the development of its advanced, high-speed interconnect designs at its Kilby Center facility in Dallas, Texas.
"The Black Diamond technology combines a significant reduction in
dielectric constant with an evolutionary manufacturing approach that
builds on our extensive knowledge of CVD process technology. By
focusing on productivity and integration, we see this film as a
potential solution to our advanced interconnect challenges," said Bob
Helms, vice president and director of Silicon Technology Research at
TI. "Such low k processes will contribute over time to major increases
in device speed."
Introduced in 1998, the Black Diamond film has a dielectric
constant (k) of less than or equal to 2.7, and is designed for
0.18-micron and beyond device technologies with speeds of up to one
gigahertz. The film can be used as a dielectric for both aluminum and
copper-based damascene interconnect designs to dramatically reduce
interconnect delays and increase device performance. The Black Diamond
CVD process is available on Applied Materials' Centura(R) platform in
a high-productivity configuration with up to four process chambers and
is expected to be available later this year on the company's recently
introduced Producer(TM) platform for high-throughput volume
manufacturing.
"TI's evaluations of this film has increased our understanding of
Black Diamond technology and its worthiness for manufacturing," said
Dr. Farhad Moghadam, vice president and general manager of the
Dielectric Deposition Products Division at Applied Materials. "TI's
applications are sophisticated and far-reaching with world-class chip
manufacturing technology. We are pleased that they have chosen to
evaluate Black Diamond as a low k solution to their leading-edge
designs."
Of increasing importance to customers, the Black Diamond process
operates with effectively zero volatile organic compound (VOC),
perfluorocompound (PFC) and hazardous air pollutant (HAP) emissions.
This process contrasts with alternative materials, such as organic
dielectrics or spin-on films, which have high concentrations of toxic
solvents, and involve complex hazardous waste and regulatory issues
that are becoming more costly and difficult to address.
Applied Materials, Inc. is a Fortune 500 global growth company
and the world's largest supplier of wafer fabrication systems and
services to the global semiconductor industry. Applied Materials is
traded on the Nasdaq National Market System under the symbol "AMAT."
Applied Materials' web site is www.appliedmaterials.com.
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