Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
- Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)
- Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer of next-generation technologies into high-volume manufacturing
“Applied Materials and SK hynix share a long history of working together to improve the energy-efficient performance of advanced memory chips through innovations in materials engineering,” said
“The continued scaling of AI systems is driving unprecedented demand for energy-efficient memory technologies,” said Nohjung Kwak, President and CEO of SK hynix. “One of the biggest hurdles in AI progress is the growing disconnect between memory speeds and advances in processors. Our advanced memory technologies are paving the way for faster and more energy-efficient data processing, and we look forward to partnering with Applied Materials at the new EPIC Center to deliver a roadmap of innovations that enable the next generation of memory solutions optimized for AI.”
Applied and SK hynix have signed a comprehensive technology development agreement to jointly address long‑term semiconductor R&D challenges for next‑generation memory. The initial set of co‑innovation programs will focus on exploring new materials, complex integration schemes and enabling HBM-class advanced packaging, with the goal of improving the performance and manufacturability of future memory architectures. The collaboration will leverage the EPIC Center’s high-velocity co-innovation model, where SK hynix engineers will work directly alongside Applied technologists to accelerate development of new technologies. SK hynix will also take advantage of Applied’s industry-leading advanced packaging R&D capabilities in
“Continued progress in memory increasingly relies on materials engineering innovations across both the device and packaging level,” said Dr.
“Advancing memory technology for the AI era requires new approaches to developing wafer fab equipment,” said
SK hynix becomes a founding partner of the EPIC Center, building momentum as industry leaders collaborate with Applied ahead of operational readiness this year. Applied’s new,
*Capital spending is expected to scale over time to approximately
Forward-Looking Statements
This press release contains forward-looking statements, including those regarding Applied’s investment and growth strategies, the development of new materials and technologies, industry outlook and technology requirements, the plans and expectations for the EPIC Center, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: the demand for semiconductors and customers’ technology requirements; the ability to develop new and innovative technologies; the ability to obtain and protect intellectual property rights in key technologies; the ability to achieve the objectives of the EPIC Center; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-
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Source: Applied Materials, Inc.