Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
- Organizations sign five-year extension to their R&D engagement, including an expansion of the Applied Materials–Institute of
Microelectronics Center of Excellencein Advanced Packaging in Singapore
- New phase of research aims to accelerate breakthroughs in materials, equipment and process technologies for hybrid bonding and other emerging, 3D chip integration technologies
- Expansion provides semiconductor and systems companies with a complete suite of tools and technologies for developing and prototyping hybrid bonding packaging designs
As traditional Moore’s Law scaling slows, chipmakers and systems companies are increasingly looking to heterogeneous design and advanced packaging solutions to enable continued advances in power, performance, area, cost and time-to-market (PPACt™). By combining chips of various nodes and functions in a single package, heterogeneous integration also enables smaller form factors and greater design and manufacturing flexibility. An emerging form of heterogeneous integration called hybrid bonding connects chips and wafers with direct copper-to-copper bonding, thereby reducing wiring distances and increasing input/output (I/O) density. This improves power efficiency and enables greater system performance.
Under the new phase of their R&D engagement,
Singapore’s Minister for Trade and Industry, Mr.
“Creating breakthroughs in heterogeneous integration and advanced packaging is a key element of Applied Materials’ strategy to be the PPACt enablement company™ for our customers,” said Dr.
“This year marks the 30th anniversary of
“We are pleased at how
“Through this collaboration, we will see IME’s strategic R&D capabilities in advanced packaging and heterogeneous integration complement Applied Materials’ world-class expertise gained through its
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Source: Applied Materials, Inc.