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Date
Title
Dec 23, 2021
Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
Dec 2, 2021
Applied Materials Announces Cash Dividend
Nov 18, 2021
Applied Materials Announces Fourth Quarter and Fiscal Year 2021 Results
Nov 16, 2021
Applied Materials to Participate at Credit Suisse Technology Conference
Nov 5, 2021
Applied Materials Announces Q4 and FY2021 Earnings Webcast
Oct 18, 2021
Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips
Oct 1, 2021
Applied Materials Announces Executive Change
Sep 8, 2021
Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry’s Heterogeneous Integration Roadmap
Sep 8, 2021
New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency
Sep 2, 2021
Applied Materials Announces Cash Dividend
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